Intel Advances Release Date for Skylake, Kaby Lake and Coffee Lake Processors

By Jeff Harris, Posted: 04/20/17 06:05PM EDT

Intel is reportedly moving its plans a few months ahead of schedule. First, Intel is reportedly planning to unveil its Basin Falls platform, in particular the Skylake-X, Kaby Lake-X processors and X299 chipset, at the Computex event which will happen this coming May 30 to June 3 in Taipei. Next, the launch of Coffee Lake microarchitecture will be moved from early 2018 to middle of 2017.

Advancing Release of New Intel Processors

As posted by DigiTimes, according to Taiwan-based PC vendors, the introduction of Skylake-X, Kaby Lake-X processors and X299 chipset was earlier scheduled sometime in June or July. These processors are supposed to see the light of day at E3 2017. The launch of Coffee Lake microarchitecture which is reportedly based on 14nm process node was earlier scheduled for January 2018; now it was moved to August 2017, half a year ahead.

The reason behind this sudden change in schedule is the fact that AMD is now dominating and flooding the market with powerful yet cheaper processors. With the release of AMD Ryzen 7 last March 2 and Ryzen 5 series last week, and the impending release of the cheapest Ryzen 3 series by H2, Intel is cramming to get back into the market with its version of powerful processors. Question is, can they beat AMD's price?

The Basin Falls Processors

As the report from iSportsTimes suggested, the Skylake-X series will have three 140W processors featuring 6-, 8- and 10-core architectures. But the latest report confirmed the presence of a top-end 12-core Skylake-X processor. Meanwhile, the Kaby Lake-X series will have 112W quad-core processor.

Intel reportedly has another plan of release for the 14nm-based Coffee Lake-based processors. First, they will initially release several K-series Core i7 / i5 / i3 processors and its Z370 chipsets this coming August. The releases will continue at the end of 2017 or early 2018 and this will include a lot more CPUs plus H370, B360 and H310 chipsets.

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